Commanded location and calibration verification for high-speed laser motion systems

ABSTRACT

Systems and methods for analyzing laser beam characteristics in high-speed laser motion systems, wherein the high-speed laser motion systems include a laser for generating the laser beam and a build plane positioned at a predetermined location relative to the laser beam, comprising positioning a plurality of pin-hole sensors within a field of view of the laser, wherein each of the pin-hole sensors is positioned at a predetermined location; registering the predetermined location of each pin-hole sensor with the high-speed laser motion systems; directing the laser beam to the predetermined locations of each pin-hole sensor; receiving a signal from each pin-hole sensor to verify positional accuracy of the laser beam; and repeatedly redirecting the laser beam to the predetermined location of each pin-hole sensor to measure precision repeatability.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application claims the benefit of U.S. Provisional PatentApplication Ser. No. 63/339,840 filed on May 9, 2022 and entitled“Command Location and Calibration Verification for High-Speed LaserSystems”, the disclosure of which is hereby incorporated by referenceherein in its entirety and made part of the present U.S. utility patentapplication for all purposes.

BACKGROUND

The disclosed technology relates in general to laser systems having highspeed motion capability and more specifically to systems, devices, andmethods for characterizing, analyzing, and verifying proper functioningand performance of lasers used in laser processing systems having highspeed motion capability.

Laser processing typically includes using a laser beam to modify a workpiece in a predetermined manner. Laser processing ranges fromhigh-intensity laser ablation processes to significantly lower intensityprocesses such as heat treating, in which melting is avoided. Nearly alllaser processing techniques involve forming the laser beam into aspecific size and shape at a particular location or working distancefrom the laser system. Precise identification of the location where alaser system will create a focal spot having the desired characteristicsis an important aspect of creating an efficient and optimized laserprocess.

Laser processing techniques include laser beam welding (LBW), which is afusion welding process used to join materials in various configurations.Laser beam welding systems typically include a laser light source, alaser light delivery system, an optical arrangement for delivering laserthe light to a work piece, and frequently a motion system for movingeither the laser or the work piece. LBW systems may includefiber-delivered beams or open beam paths, fixed optical systems orgalvanometer systems that allow for rapid deflection of the laser beam.Mechanical motion systems may include high-speed systems or low-speedsystems depending on intended application. For the LBW process, laserlight is focused using optical arrangements that include a collimationlens or mirror (or other optic) that stops the divergence of the laserlight from the light source and delivers the light to a focusing lens ormirror. The focusing lens or mirror then directs the high-intensity,focused laser light to the work piece that is to be welded. Thehigh-intensity laser light is then used to melt the material of the workpiece and fuse two or more parts or components together.

The use of laser processing systems, particularly LBW systems, inmanufacturing has become common and such systems can be found in manymanufacturing facilities worldwide. The functional success of all laserprocessing systems depends on predetermined, stable, and repeatablelaser beam characteristics including focal spot or image shape,distribution, and location. Accordingly, there is an ongoing need foraccurate, easy to use, and affordable systems, devices, and methods foranalyzing the quality and dynamic accuracy of laser focal spots formedby laser processing systems having motion capability.

SUMMARY

The following provides a summary of certain example implementations ofthe disclosed technology. This summary is not an extensive overview andis not intended to identify key or critical aspects or elements of thedisclosed technology or to delineate its scope. However, it is to beunderstood that the use of indefinite articles in the language used todescribe and claim the disclosed technology is not intended in any wayto limit the described technology. Rather the use of “a” or “an” shouldbe interpreted to mean “at least one” or “one or more”.

One implementation of the disclosed technology provides a method foranalyzing laser beam characteristics in high-speed laser motion systems,wherein the characteristics include verifying a commanded position ofthe laser beam and verifying the ability of the laser beam to repeatedlymove to the commanded position, wherein the high-speed laser motionsystems include a laser for generating the laser beam and a build planepositioned at a predetermined location relative to the laser beam,comprising positioning a plurality of pin-hole sensors within a field ofview of the laser, wherein each of the pin-hole sensors is positioned ata predetermined location; registering the predetermined location of eachpin-hole sensor with the high-speed laser motion systems; directing thelaser beam to the predetermined locations of each pin-hole sensor;receiving a signal from each pin-hole sensor to verify positionalaccuracy of the laser beam; and repeatedly redirecting the laser beam tothe predetermined location of each pin-hole sensor to measure precisionrepeatability.

The laser beam is directed to the predetermined locations of eachpin-hole sensor at low laser powers. The laser beam is rastered over thepredetermined locations of each pin-hole sensor at high laser powers.The method may further comprise setting the build plane to apredetermined height, rastering the laser beam over the predeterminedlocation of each pin-hole sensor, and measuring spot size diameter ofthe laser beam. The method may further comprise repeatedly redirectingthe laser beam to the predetermined location of each pin-hole sensor atthe predetermined height and the second predetermined height to measureprecision repeatability.

Another implementation of the disclosed technology provides a system foranalyzing laser beam characteristics in high-speed laser motion systems,wherein the characteristics include verifying a commanded position ofthe laser beam and verifying the ability of the laser beam to repeatedlymove to the commanded position, wherein the high-speed laser motionsystems include a laser for generating the laser beam and a build planepositioned at a predetermined location relative to the laser beam,comprising a plurality of pin-hole sensors positioned within a field ofview of the laser, wherein each of the pin-hole sensors is positioned ata predetermined location, wherein the predetermined location of eachpin-hole sensor is registered with the high speed laser motion systems,wherein the laser beam is directed to the predetermined location of eachpin-hole sensor, wherein a signal is received from each pin-hole sensorto verify positional accuracy of the laser beam, and wherein the laserbeam is repeatedly redirected to the predetermined location of eachpin-hole sensor to measure precision repeatability.

The laser beam is directed to the predetermined locations of eachpin-hole sensor at low laser powers. The laser beam is rastered over thepredetermined locations of each pin-hole sensor at high laser powers.The build plane is set to a predetermined height, the laser beam israstered over the predetermined location of each pin-hole sensor, andspot size diameter of the laser beam is measured. The build plane ismoved to a second predetermined height such that the plurality ofpin-hole sensors are further from or closer to the laser beam, the laserbeam is rastered over the predetermined location of each pin-holesensor, the spot size diameter of the laser beam is measured at thesecond predetermined height, and the spot size diameter at thepredetermined height is compared to the spot size diameter at the secondpredetermined height. The laser beam is repeatedly redirected to thepredetermined location of each pin-hole sensor at the predeterminedheight and the second predetermined height to measure precisionrepeatability.

Still another implementation of the disclosed technology provides asystem for analyzing laser beam characteristics in high-speed lasermotion systems, wherein the characteristics include verifying acommanded position of the laser beam and verifying the ability of thelaser beam to repeatedly move to the commanded position, wherein thehigh-speed laser motion systems include a laser for generating the laserbeam and a build plane positioned at a predetermined location relativeto the laser beam, comprising positioning a portable testing apparatuswithin a predetermined field of view of the laser, wherein the portabletesting apparatus includes a plurality of pin-hole sensors, wherein eachof the pin-hole sensors is mounted at a predetermined location in theportable testing apparatus; registering the predetermined location ofeach pin-hole sensor with the high-speed laser beam systems; directingthe laser beam to the predetermined locations of each pin-hole sensor;receiving a signal from each pin-hole sensor to verify positionalaccuracy of the laser beam; and repeatedly redirecting the laser beam tothe predetermined location of each pin-hole sensor to measure precisionrepeatability.

The laser beam is directed to the predetermined locations of eachpin-hole sensor at low laser powers. The laser beam is rastered over thepredetermined locations of each pin-hole sensor at high laser powers.The build plane is set to a predetermined height, the laser beam israstered over the predetermined location of each pin-hole sensor, andspot size diameter of the laser beam is measured. The build plane ismoved to a second predetermined height such that the plurality ofpin-hole sensors are further from or closer to the laser beam, the laserbeam is rastered over the predetermined location of each pin-holesensor, the spot size diameter of the laser beam is measured at thesecond predetermined height, and the spot size diameter at thepredetermined height is compared to the spot size diameter at the secondpredetermined height. The laser beam is repeatedly redirected to thepredetermined location of each pin-hole sensor at the predeterminedheight and the second predetermined height to measure precisionrepeatability.

It should be appreciated that all combinations of the foregoing conceptsand additional concepts discussed in greater detail below (provided suchconcepts are not mutually inconsistent) are contemplated as being partof the technology disclosed herein and may be implemented to achieve thebenefits as described herein. Additional features and aspects of thedisclosed system, devices, and methods will become apparent to those ofordinary skill in the art upon reading and understanding the followingdetailed description of the example implementations. As will beappreciated by the skilled artisan, further implementations are possiblewithout departing from the scope and spirit of what is disclosed herein.Accordingly, the descriptions provided herein are to be regarded asillustrative and not restrictive in nature.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated into and form a partof the specification, schematically illustrate one or more exampleimplementations of the disclosed technology and, together with thegeneral description given above and detailed description given below,serve to explain the principles of the disclosed subject matter, andwherein:

FIG. 1 is a perspective view of an example testing apparatus for usewith laser powder bed fusion systems, wherein the calibrationplate/support component is shown in broken lines;

FIG. 2 is a perspective view of the testing apparatus of FIG. 1 ,wherein the calibration plate/support component and the cooling channelsformed therein are shown in broken lines;

FIG. 3 is a perspective view of the testing apparatus of FIG. 1 ,wherein the calibration plate/support in which the pin-hole definingstructures are mounted is shown in solid lines;

FIG. 4 is a perspective view of the testing apparatus of FIG. 1 ,wherein the upper surface of the calibration plate/support componentincludes a plurality of concentrically arranged ridges or raisedportions for absorbing and distributing heat generated by a laser beam;

FIG. 5A is a front view of an example pin-hole defining structure(pedestal) shown in an assembled state;

FIG. 5A;

FIG. 5B is a cross-sectional view of the pin-hole defining structure(pedestal) of FIG. 5C is an exploded perspective view of the pin-holedefining structure (pedestal) of FIG. 5A;

FIG. 6A is a front view of an example pin-hole defining structure(pedestal), wherein a fiber optic cable has been inserted into thepin-hole defining structure (pedestal);

FIG. 6B is a cross-sectional view of the pin-hole defining structure(pedestal) and fiber optic cable assembly shown in FIG. 6A;

FIG. 7A is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at afirst position;

FIG. 7B is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at asecond position;

FIG. 7C is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at athird position;

FIG. 7D is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at afourth position;

FIG. 7E is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at afifth position;

FIG. 7F is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown contacting the testing apparatus at asixth position;

FIG. 8A is a cross-sectional view of an example pin-hole definingstructure shown mounted in the calibration plate/support and receivinglaser light from a laser beam being analyzed by the testing apparatus;

FIG. 8B is a detail of the upper portion of FIG. 8A showing a portion ofthe laser light passing through a pin-hole and the remaining laser lightbeing reflected by the pin-hole defining structure;

FIG. 8C is an illustration of an example testing apparatus being used toanalyze the characteristics of a non-stationary laser beam beinggenerated by a laser source present in a laser powder bed fusion system,wherein the laser beam is shown reflecting from one of the pin-holedefining structures;

FIG. 9 depicts an example implementation of the disclosed technology forverifying a commanded position of a laser beam and verifying the abilityof the laser beam to repeatedly move to the commanded position;

FIG. 10 depicts an example implementation of the disclosed technologyfor verifying repeatability of the positioning of a high-speed laser;and

FIG. 11 depicts rastering of the laser beam of FIGS. 9-10 at high laserpowers.

DETAILED DESCRIPTION

Example implementations are now described with reference to the Figures.Reference numerals are used throughout the detailed description to referto the various elements and structures. Although the following detaileddescription contains many specifics for the purposes of illustration, aperson of ordinary skill in the art will appreciate that many variationsand alterations to the following details are within the scope of thedisclosed technology. Accordingly, the following implementations are setforth without any loss of generality to, and without imposinglimitations upon, the claimed subject matter.

The examples discussed herein are examples only and are provided toassist in the explanation of the apparatuses, devices, systems, andmethods described herein. None of the features or components shown inthe drawings or discussed below should be taken as required for anyspecific implementation of any of these the apparatuses, devices,systems or methods unless specifically designated as such. For ease ofreading and clarity, certain components, modules, or methods may bedescribed solely in connection with a specific Figure. Any failure tospecifically describe a combination or sub-combination of componentsshould not be understood as an indication that any combination orsub-combination is not possible. Also, for any methods described,regardless of whether the method is described in conjunction with a flowdiagram, it should be understood that unless otherwise specified orrequired by context, any explicit or implicit ordering of stepsperformed in the execution of a method does not imply that those stepsmust be performed in the order presented but instead may be performed ina different order or in parallel.

U.S. Pat. Nos. 10,976,219; and 10,627,311 are relevant to the disclosedtechnology and the entire contents of each of these patents is expresslyincorporated by reference herein and are made part of this patentapplication for all purposes. These references disclose a system for usein additive manufacturing, for example, which is an industrial processthat adds successive superfine layers of material to createthree-dimensional objects. Each successive layer bonds or is fused to apreceding layer of melted or partially melted material and differentsubstances for layering material, including metal powder,thermoplastics, ceramics, composites, glass, and other materials. LaserPowder Bed Fusion (L-PBF) is a specific process used in additivemanufacturing wherein a three-dimensional component or part is builtusing a layer-by-layer approach that utilizes a high-power laser. L-PBFtypically involves: (i) spreading a layer of powdered material (e.g.,metal) over a build platform or plate; (ii) using a laser to fuse thefirst layer or first cross-section of a part; (iii) spreading a newlayer of powder across the previous layer using a roller, recoater arm,coating blade, or similar device; (iv) using the laser to fuse the newlayer or new cross-section of the part; (v) adding and fusing successivelayers or cross sections; (vi) repeating the process until the entirepart is created. Loose, unfused powdered material remains in position,but is removed during post processing.

The functional success of L-PBF systems depends on the existence of aknown and stable laser focal spot on the powder bed work plane. Thetechnology disclosed in U.S. Pat. Nos. 10,976,219; and 10,627,311provides a portable testing apparatus for analyzing the quality anddynamic accuracy of laser focal spots in various L-PBF systems anddevices. This testing apparatus is used with a laser powder bed fusionadditive manufacturing device that further includes at least one laserthat generates a non-stationary laser beam having known or predeterminedcharacteristics and a build plane positioned at a predetermined locationrelative to the non-stationary laser beam, wherein the non-stationarylaser beam translates (i.e., traverses) across the build plane in acontrolled manner during additive manufacturing processes. The apparatusincludes a support having an upper surface adapted to receive and absorblaser light generated by the non-stationary laser beam; a plurality ofpin-hole defining structures each positioned to receive the laser lightgenerated by the non-stationary laser beam, and such that each pin-holeis elevated at a predetermined height above the upper surface of thesupport and parallel thereto; a fiber optic cable disposed within eachpin-hole defining structure, wherein each fiber optic cable has aproximal end at which the laser light is received through the pin-holeand a distal end to which the laser light is delivered; and aphotodetector located at the distal end of each fiber optic cable,wherein the photodetector converts the laser light delivered to thephotodetector into electrical voltage output signals based on intensityof the laser light received through each pin-hole. FIGS. 1-4, 5A-C,6A-6B, 7A-F, and 8A-C provide various illustrative views of an exampletesting apparatus for analyzing the quality and dynamic accuracy oflaser focal spots in various laser-based manufacturing systems includingL-PBF systems and laser beam welding (LBW) systems.

As best shown in FIGS. 1-4 , example testing apparatus 10 includessupport 100; base 200; pin-hole defining structures or pin-hole sensors300, 400, 500, and 600, which are mounted in support 100; andphotodetector 700, which is located in base 200. Support 100, which isroughly square in shape, and which may be referred to as a calibrationplate, includes an absorptive upper surface 110, which may furtherinclude a series of concentrically arranged ridges or other raisedstructures (see FIG. 4 ) that absorb and distribute heat generated bythe laser beam for preventing damage to upper surface 110 and support100. Support 100 further includes first mounting recess 120 (forreceiving first pin-hole defining structure 300), first set screwaperture 122 (for receiving a set screw that secures first pin-holedefining structure 300 within first mounting recess 120), secondmounting recess 130 (for receiving second pin-hole defining structure400), second set screw aperture 132 (for receiving a set screw thatsecures second pin-hole defining structure 400 within second mountingrecess 130), third mounting recess 140 (for receiving third pin-holedefining structure 500), third set screw aperture 142 (for receiving aset screw that secures third pin-hole defining structure 500 withinthird mounting recess 140, fourth mounting recess 150 (for receivingfourth pin-hole defining structure 600), and fourth set screw aperture152 (for receiving a set screw that secures fourth pin-hole definingstructure 600 within fourth mounting recess 150). Support 100 alsoincludes first aperture 160 for receiving first coolant fitting 162,second aperture 164 for receiving second coolant fitting 166 andchannels 170 for receiving and transporting liquid or gas coolant thattransfers energy absorbed by support 100 away from testing apparatus 10.

Also, as best shown in FIGS. 1-4 , base 200, the shape of whichcorresponds to the shape of support 100, cooperates with support 100 toform an enclosure. Base 200 includes outer wall 210 and inner cavity 212in which photodetector 700 and the various fiber optic cables attachedto the pin-hole defining structures are placed. Base 200 also includesaperture 214 for receiving Bayonet Neill-Concelman (BNC) bulkhead 216 towhich BNC connector 218 is attached, second aperture 220 for receivinggas fitting 222, and third aperture 224 for receiving gas relief valve226. In certain embodiments, a source of pressurized gas is connected togas fitting 222 for delivering outwardly flowing gas to and through eachpin-hole for preventing the contamination thereof by debris generatedduring the testing process or other debris.

With reference to FIGS. 1-4, 5A-C, and 6A-6B, the example embodiment oftesting apparatus 10 shown in the Figures includes four pin-holedefining structures, which are also referred to as “pedestals”. FIGS.5A-C and 6A-6B illustrate only first pin-hole defining structure 300;however, the remaining pin-hole defining structures (400, 500, and 600)are constructed in the same manner as first pin-hole defining structure300. Accordingly, FIGS. 5A-C and 6A-6B are meant to be representative ofall of the pin-hole defining structures depicted in the Figures.

As shown in FIGS. 5A-C and 6A-6B, first pin-hole defining structure orpedestal 300 includes first pin-hole 302, which is formed in tip 304through which channel 306 passes. The diameter of pin-hole 302 istypically one third to one-thirtieth the diameter of the laser beambeing characterized by testing apparatus 10 (e.g., pinhole diameter:5-50 μm). Tip 304 typically includes a highly reflective material suchas gold, copper, or other reflective metal for minimizing damage to thepin-hole and pin-hole defining structure caused by absorption of energyfrom the laser beam. Tip 304 is mounted within body 310 which includestapered portion 312 and cylindrical portion 326 through which channel328 passes. First set screw aperture 330 is adapted to receive first setscrew 332 which secures first fiber optic cable 350 in body 310. Firstoptical fiber 352 is inserted into channel 306 and brought into closeproximity with first pin-hole 302. First pin-hole defining structure orpedestal 300 is mounted within support 100 such that the pin-hole iselevated above upper surface 110 at a height (e.g. 20 to 40 mm) thatminimizes any damage to the pin-hole and pedestal that may be caused bythe energy of the non-stationary laser beam.

FIGS. 7A-7F are illustrations of testing apparatus 10 being used toanalyze the characteristics of a non-stationary laser beam generated bya laser source present in a laser powder bed fusion system being usedfor additive manufacturing. In these Figures, laser source or laser 800generates laser beam 802, which contacts upper surface 110 of testingapparatus 10 at multiple positions or locations, including locationsthat include the previous discussed pin-holes. During the normaloperation of testing apparatus 10, laser beam 802 is continuallymanipulated at typical operating power for bringing all the laser beamdelivery elements of the laser powder bed fusion machine or system up tonormal operating temperature and functionality such that anymisalignment of laser beam 802 or loss of laser focus quality may bedetected.

FIG. 8A provides a cross-sectional view of pin-hole defining structure300 shown mounted in support 100 and receiving laser light from laserbeam 802 during normal operation of a laser powder bed fusion systembeing analyzed. FIG. 8B is a detail of the upper portion of FIG. 8Ashowing the laser light being reflected by pin-hole defining structure300; and FIG. 8C provides an illustration of testing apparatus 10 beingused to analyze the characteristics of non-stationary laser beam 802being generated by laser source 800, wherein laser beam 802 is shownreflecting from pin-hole defining structure 400. In FIGS. 8A-8B, lightfrom laser beam 802 is shown passing through pin-hole 302 and enteringoptical fiber 352 through which the signal is transmitted tophotodetector 700 (see FIG. 1 ). The laser light than passes throughpin-hole 302 is only a small amount of the laser light generated bylaser beam 802. For example, for a laser beam having a total diameter ofabout 0.1 mm, the diameter of the portion of the beam that passes thoughpin-hole 302 would be about 0.025 mm. Laser light collected from eachpin-hole may be transmitted to one or more light measuring devicesthrough fiber optic coupling. Testing apparatus 10 includes a dataacquisition device in communication with photodetector 700, wherein thedata acquisition device receives, saves, organizes, and analyzeselectrical signals as a function of time, or time and position, relativeto the pin-holes through which the laser light was received. A dataanalysis algorithm associated with the data acquisition devicecalculates and determines laser beam quality based on data acquired frommultiple passes of the non-stationary laser beam over the plurality ofpin-holes. The data acquisition device may also include hardware and/orsoftware (e.g., blue tooth or the like) that enables the transmission ofdata to a receiver located outside of an additive manufacturing device.

High-speed laser motion systems such as, for example, laser scanners,require calibration for reasons related to laser accuracy and optimalsystem functionality. Typically, high-speed laser motion systems arecalibrated at the time of manufacture or service by etching a plate andevaluating the etched plate with a measurement device or building fullparts and then confirming part dimensions. This method is inaccurate andoften introduces error into the system. The systems, devices, andmethods described above, and in U.S. Patent Publication No.2021/0223140, which is also incorporated by reference herein in itsentirety, are useful for analyzing many aspects of high-speed lasermotion systems. In one implementation, the disclosed technology is usedin a method for analyzing: (i) the ability of a high-speed laser motionsystem to accurately position a laser beam in a commanded location, and(ii) the capability of the system to repeatedly move to that location ina precise manner.

To perform such verifications, a measurement device including one ormore pinhole sensors is precisely registered in the high-speed lasermotion system to be analyzed at a specific, known or predeterminedlocation using the same laser beam used for processing. The high-speedlaser motion system is then commanded at low laser powers to thatspecific location and positional accuracy is confirmed by a signalreceived by the measurement device. For positional accuracyverifications at higher laser powers, the laser beam is rastered overthe measurement device and with positional feedback from the high-speedlaser motion system, the locations where signal is received are recordedand compared to the known position of the measurement device.

Precision repeatability of high-speed laser motion systems can also beevaluated with a measurement device including one or more pinholesensors. By using the measurement techniques disclosed above andrepeating the measurements multiple times as shown in FIGS. 9-10 , themeasurement device monitors accuracy over time (e.g., after heating ofthe high-speed laser motion systems and heating of the laser optics).Repeatability of other mechanical motion components in the system areevaluated by affixing the measurement device to those components, takingmeasurements, moving to a different location or height, and then movingback to the original location followed by at least one additionalmeasurement. In some implementations, an algorithm is used to provideany necessary corrections in situations where the pinhole sensors arenot recognized.

Advantages of the disclosed technology include the following. Thedisclosed system and device: (i) can be used to verify the accuracy andrepeatability of a laser motion system; and (ii) can measure at lowpower or with guide beam using stationary measurements by parking thebeam on the pinhole. High-power in motion measurements can be performedby rastering the beam and analyzing the resulting data and recordedlocation. A different axis can be evaluated with the laser beam in astationary location on the measurement pinhole, moving the other axis,and then moving back and comparing data. Prior art systems includingPrimes Scan Field Monitor and Ophir Beam Watch AM are limited insampling capability and location (or are incapable thereof). Thesesystems have limited or no capability to sample the beam in motion, asit would be used in-process, and these systems have no currentcapability to sample the beam during a build. Additionally, thesesystems have no precision locating and cannot evaluate scanner position.Numerous business entities are original equipment manufacturers, users,customizers, and analyzers of laser processing systems, including laserpowder bed fusion systems and remote laser welding systems. Commerciallyavailable analytical systems are not sufficient for analyzing laserprocessing systems due to design limitations that require stationarybeams and because large analytical systems limit the field of view areasthat can be analyzed. Additionally, industry standards such as AMS 7003create demand for a system such as the disclosed technology, which doesnot suffer from the design limitations of existing systems.

FIG. 9 depicts testing apparatus 10 being used to verify a commandedposition of non-stationary laser beam 802 and to verify the ability ofnon-stationary laser beam 802 to repeatedly move to the commandedposition. As shown in FIG. 9 , testing apparatus 10 having pin-holesensors 300, 400, 500, 600 is positioned in a field of view of laser800. Pin-hole sensors 300, 400, 500, 600 are mounted at predeterminedlocations in testing apparatus 10. Laser 800 generates non-stationarylaser beam 802, which directs non-stationary laser beam 802 to a centerposition on testing apparatus 10. Non-stationary laser beam 802 is thendirected to pin-hole sensor 300, having a predetermined location, whichis registered. Pin-hole sensor 300 verifies the positional accuracy ofnon-stationary laser beam 802 at the predetermined location of pin-holesensor 300. Non-stationary laser beam 802 is then directed to pin-holesensor 600, having a predetermined location, which is registered.Pin-hole sensor 600 verifies the positional accuracy of non-stationarylaser beam 802 at the predetermined location of pin-hole sensor 600.Non-stationary laser beam 802 is then repeatedly redirected to pin-holesensors 300, 600 to measure precision repeatability.

FIG. 10 depicts testing apparatus 10 being used to verify heightposition calibration of non-stationary laser beam 802. As shown in FIG.10 , testing apparatus 10 having pin-hole sensors 300, 400, 500, 600 ispositioned in a field of view of laser 800. Testing apparatus 10 ispositioned on build plane 900 of the high-speed laser motion system,wherein build plane 900 is positioned at first predetermined height Xrelative to non-stationary laser beam 802. Pin-hole sensors 300, 400,500, 600 are mounted at predetermined locations in testing apparatus 10.Laser 800 generates non-stationary laser beam 802, which directsnon-stationary laser beam 802 to pin-hole sensor 300, which measuresspot size diameter of non-stationary laser beam 802. Build plane 900 isthen adjusted to second predetermined height Y. In this exampleembodiment, build plane 900 is adjusted such that pin-hole sensors 300,400, 500, 600 are at a greater distance from non-stationary laser beam802. Non-stationary laser beam 802 is then directed to pin-hole sensor300 at second predetermined height Y of build plane 900, the spot sizediameter of non-stationary laser beam 802 is measured, and the spot sizediameter measured at first predetermined height Xof build plane 900 iscompared to the spot size dimeter measured at second predeterminedheight Y. Build plane 900 is then adjusted back to first predeterminedheight X, wherein non-stationary laser beam 802 is repeatedly redirectedto pin-hole sensor 300 at first predetermined height X and secondpredetermined height Y to measure precision repeatability.

FIG. 11 depicts rastering 1000 of non-stationary laser beam 802 acrosspin-hole sensor 300 at high laser powers. The systems and methodsdescribed and depicted in FIGS. 9-10 direct non-stationary laser beam802 to the predetermined location of pin-hole sensor 300 at low laserpowers, wherein non-stationary laser beam 802 is rastered 1000 across anarea on or near pin-hole sensor 300 at high laser powers.

All literature and similar material cited in this application,including, but not limited to, patents, patent applications, articles,books, treatises, and web pages, regardless of the format of suchliterature and similar materials, are expressly incorporated byreference in their entirety. Should one or more of the incorporatedreferences and similar materials differs from or contradicts thisapplication, including but not limited to defined terms, term usage,described techniques, or the like, this application controls.

As previously stated and as used herein, the singular forms “a,” “an,”and “the,” refer to both the singular as well as plural, unless thecontext clearly indicates otherwise. The term “comprising” as usedherein is synonymous with “including,” “containing,” or “characterizedby,” and is inclusive or open-ended and does not exclude additional,unrecited elements or method steps. Although many methods and materialssimilar or equivalent to those described herein can be used, particularsuitable methods and materials are described herein. Unless contextindicates otherwise, the recitations of numerical ranges by endpointsinclude all numbers subsumed within that range. Furthermore, referencesto “one implementation” are not intended to be interpreted as excludingthe existence of additional implementations that also incorporate therecited features. Moreover, unless explicitly stated to the contrary,implementations “comprising” or “having” an element or a plurality ofelements having a particular property may include additional elementswhether or not they have that property.

The terms “substantially” and “about”, if or when used throughout thisspecification describe and account for small fluctuations, such as dueto variations in processing. For example, these terms can refer to lessthan or equal to ±5%, such as less than or equal to ±2%, such as lessthan or equal to ±1%, such as less than or equal to ±0.5%, such as lessthan or equal to ±0.2%, such as less than or equal to ±0.1%, such asless than or equal to ±0.05%, and/or 0%.

Underlined and/or italicized headings and subheadings are used forconvenience only, do not limit the disclosed subject matter, and are notreferred to in connection with the interpretation of the description ofthe disclosed subject matter. All structural and functional equivalentsto the elements of the various implementations described throughout thisdisclosure that are known or later come to be known to those of ordinaryskill in the art are expressly incorporated herein by reference andintended to be encompassed by the disclosed subject matter. Moreover,nothing disclosed herein is intended to be dedicated to the publicregardless of whether such disclosure is explicitly recited in the abovedescription.

There may be many alternate ways to implement the disclosed technology.Various functions and elements described herein may be partitioneddifferently from those shown without departing from the scope of thedisclosed technology. Generic principles defined herein may be appliedto other implementations. Different numbers of a given module or unitmay be employed, a different type or types of a given module or unit maybe employed, a given module or unit may be added, or a given module orunit may be omitted.

Regarding this disclosure, the term “a plurality of” refers to two ormore than two. Unless otherwise clearly defined, orientation orpositional relations indicated by terms such as “upper” and “lower” arebased on the orientation or positional relations as shown in thefigures, only for facilitating description of the disclosed technologyand simplifying the description, rather than indicating or implying thatthe referred devices or elements must be in a particular orientation orconstructed or operated in the particular orientation, and thereforethey should not be construed as limiting the disclosed technology. Theterms “connected”, “mounted”, “fixed”, etc. should be understood in abroad sense. For example, “connected” may be a fixed connection, adetachable connection, or an integral connection; a direct connection,or an indirect connection through an intermediate medium. For anordinary skilled in the art, the specific meaning of the above terms inthe disclosed technology may be understood according to specificcircumstances.

Specific details are given in the above description to provide athorough understanding of the disclosed technology. However, it isunderstood that the disclosed embodiments and implementations can bepracticed without these specific details. For example, circuits can beshown in block diagrams in order not to obscure the disclosedimplementations in unnecessary detail. In other instances, well-knowncircuits, processes, algorithms, structures, and techniques can be shownwithout unnecessary detail in order to avoid obscuring the disclosedimplementations.

Implementation of the techniques, blocks, steps and means describedabove can be accomplished in various ways. For example, thesetechniques, blocks, steps and means can be implemented in hardware,software, or a combination thereof. For a hardware implementation, theprocessing units can be implemented within one or more applicationspecific integrated circuits (ASICs), digital signal processors (DSPs),digital signal processing devices (DSPDs), programmable logic devices(PLDs), field programmable gate arrays (FPGAs), processors, controllers,micro-controllers, microprocessors, other electronic units designed toperform the functions described above, and/or a combination thereof.

The disclosed technology can be described as a process which is depictedas a flowchart, a flow diagram, a data flow diagram, a structurediagram, or a block diagram. Although a flowchart can describe theoperations as a sequential process, many of the operations can beperformed in parallel or concurrently. In addition, the order of theoperations can be re-arranged. A process is terminated when itsoperations are completed, but could have additional steps not includedin the figure. A process can correspond to a method, a function, aprocedure, a subroutine, a subprogram, etc. When a process correspondsto a function, its termination corresponds to a return of the functionto the calling function or the main function.

Furthermore, the disclosed technology can be implemented by hardware,software, scripting languages, firmware, middleware, microcode, hardwaredescription languages, and/or any combination thereof. When implementedin software, firmware, middleware, scripting language, and/or microcode,the program code or code segments to perform the necessary tasks can bestored in a machine readable medium such as a storage medium. A codesegment or machine-executable instruction can represent a procedure, afunction, a subprogram, a program, a routine, a subroutine, a module, asoftware package, a script, a class, or any combination of instructions,data structures, and/or program statements. A code segment can becoupled to another code segment or a hardware circuit by passing and/orreceiving information, data, arguments, parameters, and/or memorycontents. Information, arguments, parameters, data, etc. can be passed,forwarded, or transmitted via any suitable means including memorysharing, message passing, ticket passing, network transmission, etc.

It should be appreciated that all combinations of the foregoing conceptsand additional concepts discussed in greater detail herein (providedsuch concepts are not mutually inconsistent) are contemplated as beingpart of the disclosed technology. In particular, all combinations ofclaimed subject matter appearing at the end of this disclosure arecontemplated as being part of the technology disclosed herein. While thedisclosed technology has been illustrated by the description of exampleimplementations, and while the example implementations have beendescribed in certain detail, there is no intention to restrict or in anyway limit the scope of the appended claims to such detail. Additionaladvantages and modifications will readily appear to those skilled in theart. Therefore, the disclosed technology in its broader aspects is notlimited to any of the specific details, representative devices andmethods, and/or illustrative examples shown and described. Accordingly,departures may be made from such details without departing from thespirit or scope of the general inventive concept.

What is claimed:
 1. A method for analyzing laser beam characteristics inhigh-speed laser motion systems, wherein the characteristics includeverifying a commanded position of the laser beam and verifying theability of the laser beam to repeatedly move to the commanded position,wherein the high-speed laser motion systems include a laser forgenerating the laser beam and a build plane positioned at apredetermined location relative to the laser beam, comprising: (a)positioning a plurality of pin-hole sensors within a field of view ofthe laser, wherein each of the pin-hole sensors is positioned at apredetermined location; (b) registering the predetermined location ofeach pin-hole sensor with the high-speed laser motion systems; (c)directing the laser beam to the predetermined locations of each pin-holesensor; (d) receiving a signal from each pin-hole sensor to verifypositional accuracy of the laser beam; and (e) repeatedly redirectingthe laser beam to the predetermined location of each pin-hole sensor tomeasure precision repeatability.
 2. The method of claim 1, wherein thelaser beam is directed to the predetermined locations of each pin-holesensor at low laser powers.
 3. The method of claim 1, wherein the laserbeam is rastered over the predetermined locations of each pin-holesensor at high laser powers.
 4. The method of claim 1, furthercomprising: (a) setting the build plane to a predetermined height, (b)rastering the laser beam over the predetermined location of eachpin-hole sensor, and (c) measuring spot size diameter of the laser beam.5. The method of claim 4, further comprising: (a) moving the build planeto a second predetermined height such that the plurality of pin-holesensors are further from or closer to the laser beam, (b) rastering thelaser beam over the predetermined locations of each pin-hole sensor, (c)measuring the spot size diameter of the laser beam at the secondpredetermined height, and (d) comparing the spot size diameter at thepredetermined height to the spot size diameter at the secondpredetermined height.
 6. The method of claim 5, further comprisingrepeatedly redirecting the laser beam to the predetermined location ofeach pin-hole sensor at the predetermined height and the secondpredetermined height to measure precision repeatability.
 7. A system foranalyzing laser beam characteristics in high-speed laser motion systems,wherein the characteristics include verifying a commanded position ofthe laser beam and verifying the ability of the laser beam to repeatedlymove to the commanded position, wherein the high-speed laser motionsystems include a laser for generating the laser beam and a build planepositioned at a predetermined location relative to the laser beam,comprising: (a) a plurality of pin-hole sensors positioned within afield of view of the laser, wherein each of the pin-hole sensors ispositioned at a predetermined location, wherein the predeterminedlocation of each pin-hole sensor is registered with the high speed lasermotion systems, wherein the laser beam is directed to the predeterminedlocation of each pin-hole sensor, wherein a signal is received from eachpin-hole sensor to verify positional accuracy of the laser beam, andwherein the laser beam is repeatedly redirected to the predeterminedlocation of each pin-hole sensor to measure precision repeatability. 8.The system of claim 7, wherein the laser beam is directed to thepredetermined locations of each pin-hole sensor at low laser powers. 9.The system of claim 7, wherein the laser beam is rastered over thepredetermined locations of each pin-hole sensor at high laser powers.10. The system of claim 7, wherein the build plane is set to apredetermined height, the laser beam is rastered over the predeterminedlocation of each pin-hole sensor, and spot size diameter of the laserbeam is measured.
 11. The system of claim 10, wherein the build plane ismoved to a second predetermined height such that the plurality ofpin-hole sensors are further from or closer to the laser beam, the laserbeam is rastered over the predetermined location of each pin-holesensor, the spot size diameter of the laser beam is measured at thesecond predetermined height, and the spot size diameter at thepredetermined height is compared to the spot size diameter at the secondpredetermined height.
 12. The system of claim 11, wherein the laser beamis repeatedly redirected to the predetermined location of each pin-holesensor at the predetermined height and the second predetermined heightto measure precision repeatability.
 13. A system for analyzing laserbeam characteristics in high-speed laser motion systems, wherein thecharacteristics include verifying a commanded position of the laser beamand verifying the ability of the laser beam to repeatedly move to thecommanded position, wherein the high-speed laser motion systems includea laser for generating the laser beam and a build plane positioned at apredetermined location relative to the laser beam, comprising: (a)positioning a portable testing apparatus within a predetermined field ofview of the laser, wherein the portable testing apparatus includes: (i)a plurality of pin-hole sensors, wherein each of the pin-hole sensors ismounted at a predetermined location in the portable testing apparatus;(b) registering the predetermined location of each pin-hole sensor withthe high-speed laser motion systems; (c) directing the laser beam to thepredetermined locations of each pin-hole sensor; (d) receiving a signalfrom each pin-hole sensor to verify positional accuracy of the laserbeam; and (e) repeatedly redirecting the laser beam to the predeterminedlocation of each pin-hole sensor to measure precision repeatability. 14.The system of claim 13, wherein the laser beam is directed to thepredetermined locations of each pin-hole sensor at low laser powers. 15.The system of claim 13, wherein the laser beam is rastered over thepredetermined locations of each pin-hole sensor at high laser powers.16. The system of claim 13, wherein the build plane is set to apredetermined height, the laser beam is rastered over the predeterminedlocation of each pin-hole sensor, and spot size diameter of the laserbeam is measured.
 17. The system of claim 16, wherein the build plane ismoved to a second predetermined height such that the plurality ofpin-hole sensors are further from or closer to the laser beam, the laserbeam is rastered over the predetermined location of each pin-holesensor, the spot size diameter of the laser beam is measured at thesecond predetermined height, and the spot size diameter at thepredetermined height is compared to the spot size diameter at the secondpredetermined height.
 18. The system of claim 17, wherein the laser beamis repeatedly redirected to the predetermined location of each pin-holesensor at the predetermined height and the second predetermined heightto measure precision repeatability.